Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating

K. Hatakeyama; E. Sarajlic; M.H. Siekman; L. Jalabert; H. Fujita; N.R. Tas; L. Abelmann

doi:10.1109/MEMSYS.2014.6765840

Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating

K. Hatakeyama
, E. Sarajlic
, M.H. Siekman
, L. Jalabert
, H. Fujita
, N.R. Tas
, L. Abelmann

Mesoscale Chemical Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

4 Citations (Scopus)

54 Downloads (Pure)

Abstract

Scanning Thermal Microscopy (SThM) and micro-thermal analysis allow the study of thermal phenomena at micro- and nanoscale. We present a novel scanning resistive probe aimed for thermal imaging and localized thermal analysis. The probe features an AFM cantilever with a sharp pyramidal tip. Metal nanowires are integrated at the inner edges of the pyramidal tip forming an electrical cross-junction at the apex. The nanometer- sized cross-junction, addressable through microelectrodes, can be utilized both as a local temperature sensor and a heater. We have fabricated a first prototype of the probe with a 150 um long, 36 um wide and 0.5 um thick silicon nitride cantilever. Platinum nanowires, 300 nm wide and 100 nm thick, are successfully integrated using a wafer-scale fabrication process based on corner lithography. We have experimentally characterized electrical and thermal properties of the probe demonstrating its proper functioning.

Original language	English
Title of host publication	2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	1111-1114
Number of pages	4
ISBN (Print)	978-1-4799-3508-6
DOIs	https://doi.org/10.1109/MEMSYS.2014.6765840
Publication status	Published - 26 Jan 2014
Event	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, United States Duration: 26 Jan 2014 → 30 Jan 2014 Conference number: 27

Publication series

Name	Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Publisher	IEEE
Number	27
Volume	2014
ISSN (Print)	1084-6999

Conference

Conference	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Abbreviated title	MEMS
Country/Territory	United States
City	San Francisco
Period	26/01/14 → 30/01/14

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10.1109/MEMSYS.2014.6765840

ArticleFinal published version, 2.16 MBLicence: Taverne

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Hatakeyama, K., Sarajlic, E., Siekman, M. H., Jalabert, L., Fujita, H., Tas, N. R., & Abelmann, L. (2014). Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating. In 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 1111-1114). (Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2014, No. 27). IEEE. https://doi.org/10.1109/MEMSYS.2014.6765840

Hatakeyama, K. ; Sarajlic, E. ; Siekman, M.H. et al. / Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating. 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway, NJ : IEEE, 2014. pp. 1111-1114 (Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 27).

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title = "Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating",

abstract = "Scanning Thermal Microscopy (SThM) and micro-thermal analysis allow the study of thermal phenomena at micro- and nanoscale. We present a novel scanning resistive probe aimed for thermal imaging and localized thermal analysis. The probe features an AFM cantilever with a sharp pyramidal tip. Metal nanowires are integrated at the inner edges of the pyramidal tip forming an electrical cross-junction at the apex. The nanometer- sized cross-junction, addressable through microelectrodes, can be utilized both as a local temperature sensor and a heater. We have fabricated a first prototype of the probe with a 150 um long, 36 um wide and 0.5 um thick silicon nitride cantilever. Platinum nanowires, 300 nm wide and 100 nm thick, are successfully integrated using a wafer-scale fabrication process based on corner lithography. We have experimentally characterized electrical and thermal properties of the probe demonstrating its proper functioning.",

author = "K. Hatakeyama and E. Sarajlic and M.H. Siekman and L. Jalabert and H. Fujita and N.R. Tas and L. Abelmann",

year = "2014",

month = jan,

day = "26",

doi = "10.1109/MEMSYS.2014.6765840",

language = "English",

isbn = "978-1-4799-3508-6",

series = "Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

publisher = "IEEE",

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booktitle = "2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)",

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Hatakeyama, K, Sarajlic, E, Siekman, MH, Jalabert, L, Fujita, H, Tas, NR & Abelmann, L 2014, Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating. in 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS). Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS), no. 27, vol. 2014, IEEE, Piscataway, NJ, pp. 1111-1114, 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014, San Francisco, California, United States, 26/01/14. https://doi.org/10.1109/MEMSYS.2014.6765840

Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating. / Hatakeyama, K.; Sarajlic, E.; Siekman, M.H. et al.
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway, NJ: IEEE, 2014. p. 1111-1114 (Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2014, No. 27).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating

AU - Hatakeyama, K.

AU - Sarajlic, E.

AU - Siekman, M.H.

AU - Jalabert, L.

AU - Fujita, H.

AU - Tas, N.R.

AU - Abelmann, L.

N1 - Conference code: 27

PY - 2014/1/26

Y1 - 2014/1/26

N2 - Scanning Thermal Microscopy (SThM) and micro-thermal analysis allow the study of thermal phenomena at micro- and nanoscale. We present a novel scanning resistive probe aimed for thermal imaging and localized thermal analysis. The probe features an AFM cantilever with a sharp pyramidal tip. Metal nanowires are integrated at the inner edges of the pyramidal tip forming an electrical cross-junction at the apex. The nanometer- sized cross-junction, addressable through microelectrodes, can be utilized both as a local temperature sensor and a heater. We have fabricated a first prototype of the probe with a 150 um long, 36 um wide and 0.5 um thick silicon nitride cantilever. Platinum nanowires, 300 nm wide and 100 nm thick, are successfully integrated using a wafer-scale fabrication process based on corner lithography. We have experimentally characterized electrical and thermal properties of the probe demonstrating its proper functioning.

AB - Scanning Thermal Microscopy (SThM) and micro-thermal analysis allow the study of thermal phenomena at micro- and nanoscale. We present a novel scanning resistive probe aimed for thermal imaging and localized thermal analysis. The probe features an AFM cantilever with a sharp pyramidal tip. Metal nanowires are integrated at the inner edges of the pyramidal tip forming an electrical cross-junction at the apex. The nanometer- sized cross-junction, addressable through microelectrodes, can be utilized both as a local temperature sensor and a heater. We have fabricated a first prototype of the probe with a 150 um long, 36 um wide and 0.5 um thick silicon nitride cantilever. Platinum nanowires, 300 nm wide and 100 nm thick, are successfully integrated using a wafer-scale fabrication process based on corner lithography. We have experimentally characterized electrical and thermal properties of the probe demonstrating its proper functioning.

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DO - 10.1109/MEMSYS.2014.6765840

M3 - Conference contribution

SN - 978-1-4799-3508-6

T3 - Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 1111

EP - 1114

BT - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

PB - IEEE

CY - Piscataway, NJ

T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014

Y2 - 26 January 2014 through 30 January 2014

ER -

Hatakeyama K, Sarajlic E, Siekman MH, Jalabert L, Fujita H, Tas NR et al. Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating. In 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway, NJ: IEEE. 2014. p. 1111-1114. (Proceedings IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 27). doi: 10.1109/MEMSYS.2014.6765840

Wafer-scale fabrication of scanning thermal probes with integrated metal nanowire resistive elements for sensing and heating

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