Wafer scale nano-membranes supported on a silicon microsieve

S. Unnikrishnan; Henricus V. Jansen; Johan W. Berenschot; Michael Curt Elwenspoek

Wafer scale nano-membranes supported on a silicon microsieve

S. Unnikrishnan, Henricus V. Jansen, Johan W. Berenschot, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

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Abstract

A new micromachining method to fabricate wafer scale, atomically smooth nano-membranes is described. The delicate membrane is supported on a robust silicon microsieve fabricated by plasma etching. The supporting sieve is micromachined independently of the nano-membrane, which is later fusion bonded to it. The transferred thin-film membrane can be dense, porous or perforated according to the application desired. One of the main application areas for such membranes is in fluidics, where the small thickness and high strength of the supported nano-membranes is a big advantage. The novel method described enables to easily up-scale and interface micro or nano-membranes to the macro-world

Original language	Undefined
Title of host publication	Micromechanics Europe 2007
Place of Publication	Portugal
Publisher	University of Minho
Pages	127-130
Number of pages	4
ISBN (Print)	978-972-98603-3-1
Publication status	Published - Sept 2007
Event	18th MicroMechanics Europe Workshop, MME 2007 - Guimaraes, Portugal Duration: 16 Sept 2007 → 18 Sept 2007 Conference number: 18

Publication series

Name
Publisher	University of Minho
Number	2008/16200

Workshop

Workshop	18th MicroMechanics Europe Workshop, MME 2007
Abbreviated title	MME
Country/Territory	Portugal
City	Guimaraes
Period	16/09/07 → 18/09/07

Keywords

EWI-14693
METIS-255042
IR-65248

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Cite this

@inproceedings{b81a5424ec94416a81e8645bdd950aee,

title = "Wafer scale nano-membranes supported on a silicon microsieve",

abstract = "A new micromachining method to fabricate wafer scale, atomically smooth nano-membranes is described. The delicate membrane is supported on a robust silicon microsieve fabricated by plasma etching. The supporting sieve is micromachined independently of the nano-membrane, which is later fusion bonded to it. The transferred thin-film membrane can be dense, porous or perforated according to the application desired. One of the main application areas for such membranes is in fluidics, where the small thickness and high strength of the supported nano-membranes is a big advantage. The novel method described enables to easily up-scale and interface micro or nano-membranes to the macro-world",

keywords = "EWI-14693, METIS-255042, IR-65248",

author = "S. Unnikrishnan and Jansen, {Henricus V.} and Berenschot, {Johan W.} and Elwenspoek, {Michael Curt}",

year = "2007",

month = sep,

language = "Undefined",

isbn = "978-972-98603-3-1",

publisher = "University of Minho",

number = "2008/16200",

pages = "127--130",

booktitle = "Micromechanics Europe 2007",

address = "Portugal",

note = "18th MicroMechanics Europe Workshop, MME 2007 ; Conference date: 16-09-2007 Through 18-09-2007",

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TY - GEN

T1 - Wafer scale nano-membranes supported on a silicon microsieve

AU - Unnikrishnan, S.

AU - Jansen, Henricus V.

AU - Berenschot, Johan W.

AU - Elwenspoek, Michael Curt

N1 - Conference code: 18

PY - 2007/9

Y1 - 2007/9

N2 - A new micromachining method to fabricate wafer scale, atomically smooth nano-membranes is described. The delicate membrane is supported on a robust silicon microsieve fabricated by plasma etching. The supporting sieve is micromachined independently of the nano-membrane, which is later fusion bonded to it. The transferred thin-film membrane can be dense, porous or perforated according to the application desired. One of the main application areas for such membranes is in fluidics, where the small thickness and high strength of the supported nano-membranes is a big advantage. The novel method described enables to easily up-scale and interface micro or nano-membranes to the macro-world

AB - A new micromachining method to fabricate wafer scale, atomically smooth nano-membranes is described. The delicate membrane is supported on a robust silicon microsieve fabricated by plasma etching. The supporting sieve is micromachined independently of the nano-membrane, which is later fusion bonded to it. The transferred thin-film membrane can be dense, porous or perforated according to the application desired. One of the main application areas for such membranes is in fluidics, where the small thickness and high strength of the supported nano-membranes is a big advantage. The novel method described enables to easily up-scale and interface micro or nano-membranes to the macro-world

KW - EWI-14693

KW - METIS-255042

KW - IR-65248

M3 - Conference contribution

SN - 978-972-98603-3-1

SP - 127

EP - 130

BT - Micromechanics Europe 2007

PB - University of Minho

CY - Portugal

T2 - 18th MicroMechanics Europe Workshop, MME 2007

Y2 - 16 September 2007 through 18 September 2007

ER -