Wafer scale nano-membranes supported on a silicon microsieve

S. Unnikrishnan, Henricus V. Jansen, Johan W. Berenschot, Michael Curt Elwenspoek

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    A new micromachining method to fabricate wafer scale, atomically smooth nano-membranes is described. The delicate membrane is supported on a robust silicon microsieve fabricated by plasma etching. The supporting sieve is micromachined independently of the nano-membrane, which is later fusion bonded to it. The transferred thin-film membrane can be dense, porous or perforated according to the application desired. One of the main application areas for such membranes is in fluidics, where the small thickness and high strength of the supported nano-membranes is a big advantage. The novel method described enables to easily up-scale and interface micro or nano-membranes to the macro-world
    Original languageUndefined
    Title of host publicationMicromechanics Europe 2007
    Place of PublicationPortugal
    PublisherUniversity of Minho
    Number of pages4
    ISBN (Print)978-972-98603-3-1
    Publication statusPublished - Sept 2007
    Event18th MicroMechanics Europe Workshop, MME 2007 - Guimaraes, Portugal
    Duration: 16 Sept 200718 Sept 2007
    Conference number: 18

    Publication series

    PublisherUniversity of Minho


    Workshop18th MicroMechanics Europe Workshop, MME 2007
    Abbreviated titleMME


    • EWI-14693
    • METIS-255042
    • IR-65248

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