Wafer-scale nanostructure formation inside vertical nano-pores

J. W. Berenschot, Xingwu Sun, H. Le The, R. M. Tiggelaar, M. J. de Boer, J. C. T. Eijkel, J. G. E. Gardeniers, N. R. Tas, E. Sarajlic

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

3 Citations (Scopus)
133 Downloads (Pure)

Abstract

We propose a wafer-scale technique for nanostructure formation inside vertically oriented, through-membrane nano-pores. It uses 50 nm monocrystalline silicon pillars as a mold, embedded in a silicon nitride membrane formed in an innovative step. The proposed technique paves the way towards advanced functionalization of parallel oriented nano-pores for actuation, sensing, filtering/trapping purposes.
Original languageEnglish
Title of host publicationIEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS 2017)
Place of PublicationPiscataway, NJ
PublisherIEEE
Number of pages4
ISBN (Electronic)978-1-5090-3059-0
ISBN (Print)978-1-5090-3060-6
Publication statusPublished - Apr 2017
Event12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - UCLA Meyer & Renee Luskin Conference Center, Los Angeles, United States
Duration: 9 Apr 201712 Apr 2017
Conference number: 12

Publication series

NameIEEE International Conference on Nano/Micro Engineered and Molecular Systems
PublisherIEEE
ISSN (Print)2474-3755

Conference

Conference12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Abbreviated titleNEMS
CountryUnited States
CityLos Angeles
Period9/04/1712/04/17

Keywords

  • Nano-pores
  • membrane
  • corner lithography
  • anisotropic etching
  • conformal deposition

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