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Wafer-scale nanostructure formation inside vertical nano-pores

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

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Abstract

We propose a wafer-scale technique for nanostructure formation inside vertically oriented, through-membrane nano-pores. It uses 50 nm monocrystalline silicon pillars as a mold, embedded in a silicon nitride membrane formed in an innovative step. The proposed technique paves the way towards advanced functionalization of parallel oriented nano-pores for actuation, sensing, filtering/trapping purposes.
Original languageEnglish
Title of host publicationIEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS 2017)
Place of PublicationPiscataway, NJ
PublisherIEEE
Number of pages4
ISBN (Electronic)978-1-5090-3059-0
ISBN (Print)978-1-5090-3060-6
Publication statusPublished - Apr 2017
Event12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - UCLA Meyer & Renee Luskin Conference Center, Los Angeles, United States
Duration: 9 Apr 201712 Apr 2017
Conference number: 12

Publication series

NameIEEE International Conference on Nano/Micro Engineered and Molecular Systems
PublisherIEEE
ISSN (Print)2474-3755

Conference

Conference12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Abbreviated titleNEMS
Country/TerritoryUnited States
CityLos Angeles
Period9/04/1712/04/17

Keywords

  • Nano-pores
  • membrane
  • corner lithography
  • anisotropic etching
  • conformal deposition

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