Wet and dry etching techniques for the release of sub-micrometre perforated membranes

S. Kuiper; Meint J. de Boer; C.J.M. van Rijn; W. Nijdam; Gijsbertus J.M. Krijnen; Michael Curt Elwenspoek

doi:10.1088/0960-1317/10/2/312

Wet and dry etching techniques for the release of sub-micrometre perforated membranes

S. Kuiper, Meint J. de Boer, C.J.M. van Rijn, W. Nijdam, Gijsbertus J.M. Krijnen, Michael Curt Elwenspoek

Research output: Contribution to journal › Article › Academic › peer-review

31 Citations (Scopus)

13 Downloads (Pure)

Abstract

For the production of microsieves we studied the release of perforated silicon nitride membranes from a silicon substrate. During the release by KOH etching the pressure build-up due to hydrogen gas formation can be quite large and cause rupture of the membrane. We explored the use of anisotropic etching with an SF6/O2 plasma to replace KOH etching. For sub-micrometre pores excellent results were obtained.

Original language	Undefined
Pages (from-to)	171-174
Number of pages	4
Journal	Journal of micromechanics and microengineering
Volume	10
Issue number	10
DOIs	https://doi.org/10.1088/0960-1317/10/2/312
Publication status	Published - Jun 2000

Keywords

METIS-111708
IR-14631
EWI-13192

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10.1088/0960-1317/10/2/312

http://eprints.eemcs.utwente.nl/secure2/13192/01/JMM_10_171.pdf

31 Citations
1 Conference contribution

Wet and dry etching techniques for the release of submicron perforated membranes
Kuiper, S., de Boer, M. J., van Rijn, C. J. M., Nijdam, W., Krijnen, G. J. M. & Elwenspoek, M. C., 12 Sept 1999, The 10th Micromechanics Europe Workshop, MME '99: September 27-28, 1999, Gif sur Yvette, France : proceedings. Orsay: Université Paris-sud, Institut d'Électronique Fondamentale, p. 168-171
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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abstract = "For the production of microsieves we studied the release of perforated silicon nitride membranes from a silicon substrate. During the release by KOH etching the pressure build-up due to hydrogen gas formation can be quite large and cause rupture of the membrane. We explored the use of anisotropic etching with an SF6/O2 plasma to replace KOH etching. For sub-micrometre pores excellent results were obtained.",

keywords = "METIS-111708, IR-14631, EWI-13192",

author = "S. Kuiper and {de Boer}, {Meint J.} and {van Rijn}, C.J.M. and W. Nijdam and Krijnen, {Gijsbertus J.M.} and Elwenspoek, {Michael Curt}",

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T1 - Wet and dry etching techniques for the release of sub-micrometre perforated membranes

AU - Kuiper, S.

AU - de Boer, Meint J.

AU - van Rijn, C.J.M.

AU - Nijdam, W.

AU - Krijnen, Gijsbertus J.M.

AU - Elwenspoek, Michael Curt

PY - 2000/6

Y1 - 2000/6

N2 - For the production of microsieves we studied the release of perforated silicon nitride membranes from a silicon substrate. During the release by KOH etching the pressure build-up due to hydrogen gas formation can be quite large and cause rupture of the membrane. We explored the use of anisotropic etching with an SF6/O2 plasma to replace KOH etching. For sub-micrometre pores excellent results were obtained.

AB - For the production of microsieves we studied the release of perforated silicon nitride membranes from a silicon substrate. During the release by KOH etching the pressure build-up due to hydrogen gas formation can be quite large and cause rupture of the membrane. We explored the use of anisotropic etching with an SF6/O2 plasma to replace KOH etching. For sub-micrometre pores excellent results were obtained.

KW - METIS-111708

KW - IR-14631

KW - EWI-13192

U2 - 10.1088/0960-1317/10/2/312

DO - 10.1088/0960-1317/10/2/312

M3 - Article

SN - 0960-1317

VL - 10

SP - 171

EP - 174

JO - Journal of micromechanics and microengineering

JF - Journal of micromechanics and microengineering

IS - 10

ER -

Wet and dry etching techniques for the release of sub-micrometre perforated membranes

Abstract

Keywords

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Wet and dry etching techniques for the release of submicron perforated membranes

Cite this