Wet and dry etching techniques for the release of sub-micrometre perforated membranes

S. Kuiper, Meint J. de Boer, C.J.M. van Rijn, W. Nijdam, Gijsbertus J.M. Krijnen, Michael Curt Elwenspoek

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    Abstract

    For the production of microsieves we studied the release of perforated silicon nitride membranes from a silicon substrate. During the release by KOH etching the pressure build-up due to hydrogen gas formation can be quite large and cause rupture of the membrane. We explored the use of anisotropic etching with an SF6/O2 plasma to replace KOH etching. For sub-micrometre pores excellent results were obtained.
    Original languageUndefined
    Pages (from-to)171-174
    Number of pages4
    JournalJournal of micromechanics and microengineering
    Volume10
    Issue number10
    DOIs
    Publication statusPublished - Jun 2000

    Keywords

    • METIS-111708
    • IR-14631
    • EWI-13192

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