Advanced packaging for SiC power modules

Lisheng Wang

doi:10.3990/1.9789036561730

Advanced packaging for SiC power modules

Lisheng Wang

Power Electronics

Research output: Thesis › PhD Thesis - Research external, graduation UT

Abstract

The PhD research focuses on exploring solutions to the interconnection challenges in packaging that hinder the exploitation of the full potential of SiC semiconductor power modules. These packaging solutions aim to enable SiC power devices to operate at higher power densities, switching speeds, efficiency, and reliability. To be more specific, a systematic study of topside interconnection and substrate attachment regarding design, materials, process, simulation, testing, and failure analysis for SiC power modules is conducted.

Original language	English
Qualification	Doctor of Philosophy
Awarding Institution	University of Twente
Supervisors/Advisors	Hueting, Ray, Supervisor Rietveld, G., Supervisor
Award date	17 Jul 2024
Place of Publication	Enschede, The Netherlands
Publisher	University of Twente
Print ISBNs	978-90-365-6172-3
Electronic ISBNs	978-90-365-6173-0
DOIs	https://doi.org/10.3990/1.9789036561730
Publication status	Published - 17 Jul 2024

Keywords

Packaging
Semiconductor
Power converter
Reliability
Materials
Interconnection
Silicon carbide

Access to Document

10.3990/1.9789036561730

Embargoed Document

PhD thesis Lisheng Wang
Final published version, 54.7 MB
Embargo ends: 9/07/26

Cite this

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AB - The PhD research focuses on exploring solutions to the interconnection challenges in packaging that hinder the exploitation of the full potential of SiC semiconductor power modules. These packaging solutions aim to enable SiC power devices to operate at higher power densities, switching speeds, efficiency, and reliability. To be more specific, a systematic study of topside interconnection and substrate attachment regarding design, materials, process, simulation, testing, and failure analysis for SiC power modules is conducted.

KW - Packaging

KW - Semiconductor

KW - Power converter

KW - Reliability

KW - Materials

KW - Interconnection

KW - Silicon carbide

U2 - 10.3990/1.9789036561730

DO - 10.3990/1.9789036561730

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SN - 978-90-365-6172-3

PB - University of Twente

CY - Enschede, The Netherlands

ER -

Advanced packaging for SiC power modules

Abstract

Keywords

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